cystech electronics corp. spec. no. : c480e2 issued date : 2010.05.26 revised date : page no. : 1/4 MSR1560E2 cystek product specification 15amp. superfast plastic rectifiers i f(av) 15a v rrm 600v i fsm 150a trr 30ns tj 175 c v f(typ) 1.9v MSR1560E2 features ? 175 operating junction temperature ? glass passivated chip junction ? low leakage current ? superfast recovery time ? low switching loss, high efficiency ? high forward surge capability ? high temperature soldering guaranteed : 260 /40s, 0.25?(6.35mm) from case ? pb-free lead plating package mechanical data ? case: to-220ac molded plastic ? mounting position: any ? weight: 1.85 grams, 0.065 ounce approximately ? terminals: pure tin plated, sold erable per j-std-002 and jesd22-b102 ? epoxy: ul 94v-0 rate flame retardant ? polarity : as marked. ? mounting torque: 10 in.-lb. maximum equivalent circuit outline to-220ac MSR1560E2 k a
cystech electronics corp. spec. no. : c480e2 issued date : 2010.05.26 revised date : page no. : 2/4 MSR1560E2 cystek product specification maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 600 v maximum rms voltage v rms 420 v maximum dc blocking voltage v dc 600 v maximum instantaneous forward voltage at i f =15a v f 1.9 2.5 v maximum average forward rectified current @ t c =100 i f(av) 15 a non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 150 a v r =600 v, t c =25 10 maximum instantaneous reverse current at v r =600 v, t c =125 i r 500 a maximum reverse recovery time i f =1a, v r =30v, di f /dt=100a/ s trr 30 ns typical junction capacitance @ f=1mhz and applied 4v reverse voltage c j 46 pf storage temperature range t stg -65 +175 operating junction temperature range t j -65 +175 thermal data parameter symbol value unit maximum thermal resistance, junction-to-case r th,j-c 1.7 c/w maximum thermal resistance, junction-to-ambient r th,j-a 60 c/w ordering information device package shipping MSR1560E2 to-220ac (rohs compliant package) 50 pcs / tube, 40 tubes/box
cystech electronics corp. spec. no. : c480e2 issued date : 2010.05.26 revised date : page no. : 3/4 MSR1560E2 cystek product specification typical characteristics forward current derating curve 0 2 4 6 8 10 12 14 16 0 25 50 75 100 125 150 175 case temperature---t c () average forward current---io(a) resistive or inductive load forward current vs forward voltage 1 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=150 reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 1000 0 100 200 300 400 500 600 reverse voltage---v r (v) reverse leakage current---i r (a) tj=75 tj=25 tj=125 junction capacitance vs reverse voltage 10 100 1000 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz per leg
cystech electronics corp. spec. no. : c480e2 issued date : 2010.05.26 revised date : page no. : 4/4 MSR1560E2 cystek product specification to-220ac dimension marking: device msr name 1560 date code k a style: pin 1.cathode 2.anode 2-lead to-220ac plastic package cystek package code: e2 *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.382 0.398 9.70 10.10 j 0.049 0.055 1.25 1.40 b 0.248 0.264 6.30 6.70 k 0.197 0.203 5.00 5.15 c 0.354 0.373 9.00 9.47 l 0.087 0.102 2.20 2.60 d 0.504 0.524 12.80 13.30 m 0.056 0.064 1.42 1.62 e 0.047 0.055 1.20 1.40 n 0.018 0.024 0.45 0.60 f 0.067* 1.70* o 0.027 0.035 0.70 0.90 g 0.098* 2.50* 0.142* 3.60* h 0.118 0.134 3.00 3.40 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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